3262003-1 by Electrodynamics Inc - Receive a Competitive Quote
| Part Number: 3262003-1 | Alternate P/N: 32620031 | Manufacturer: Electrodynamics Inc | NSN : 5962-01-363-1125 | Item Name : Microcircuit Memory | CAGE Code: 10236 | FSC : 5962 Microcircuits Electronic | ||
We’re excited to announce that 3262003-1 NSN part is now available and ready for immediate shipping. Part number 3262003-1 is a Microcircuit Memory manufactured by Electrodynamics Inc with NSN 5962013631125. Are you interested in a quick and competitive quote for this part?
Just NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of NSN (National Stock Number) parts, new and obsolete. Because of our dedication to quality, we’re the only independent distributor in the United States with a strict No China Sourcing Pledge. We’re also an AS9120B, ISO 9001:2015 certified, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). Our vast and comprehensive inventory of over 2 billion parts coupled with our shipping facilities in Washington, Oregon, California, New Maxico, Nevada, Arizona, Illinois, Minnesota, Pennsylvania, and New York, allow us to offer you some of the fastest delivery times in the industry.
If you’d like to learn more about NSN part number 3262003-1 Microcircuit Memory, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@justnsnparts.com. And, if you’d like to stay informed on new inventory or any promotions, feel free to download the ASAP Semiconductor App from Google Play or the App Store.
NSN Information for Part Number 3262003-1 with NSN 5962-01-363-1125, 5962013631125
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-363-1125 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013631125 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| ROM/PROM | 5 | 1 | 5 |
Characteristics Data of NSN 5962-01-363-1125, 5962013631125
| MRC | Criteria | Characteristic |
|---|---|---|
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CZER | MEMORY DEVICE TYPE | PAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
