I26-0026-070 by Harris Corporation - Receive a Competitive Quote
| Part Number: I26-0026-070 | Alternate P/N: I260026070 | Manufacturer: Harris Corporation | NSN : 5962-01-305-3703 | Item Name : Microcircuit Memory | CAGE Code: 14304 | FSC : 5962 Microcircuits Electronic | ||
We’re excited to announce that I26-0026-070 NSN part is now available and ready for immediate shipping. Part number I26-0026-070 is a Microcircuit Memory manufactured by Harris Corporation with NSN 5962013053703. Are you interested in a quick and competitive quote for this part?
Just NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of NSN (National Stock Number) parts, new and obsolete. Because of our dedication to quality, we’re the only independent distributor in the United States with a strict No China Sourcing Pledge. We’re also an AS9120B, ISO 9001:2015 certified, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). Our vast and comprehensive inventory of over 2 billion parts coupled with our shipping facilities in Washington, Oregon, California, New Maxico, Nevada, Arizona, Illinois, Minnesota, Pennsylvania, and New York, allow us to offer you some of the fastest delivery times in the industry.
If you’d like to learn more about NSN part number I26-0026-070 Microcircuit Memory, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@justnsnparts.com. And, if you’d like to stay informed on new inventory or any promotions, feel free to download the ASAP Semiconductor App from Google Play or the App Store.
NSN Information for Part Number I26-0026-070 with NSN 5962-01-305-3703, 5962013053703
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-305-3703 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013053703 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 280-24048-101 | 3 | 8 | E |
Characteristics Data of NSN 5962-01-305-3703, 5962013053703
| MRC | Criteria | Characteristic |
|---|---|---|
| ABKW | OVERALL HEIGHT | 0.425 INCHES MAXIMUM |
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CQZP | INPUT CIRCUIT PATTERN | 15 INPUT |
| ABMK | OVERALL WIDTH | 0.620 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 70.00 MILLIAMPERES MAXIMUM SUPPLY |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND STATIC OPERATION |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| CZER | MEMORY DEVICE TYPE | RAM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| ABHP | OVERALL LENGTH | 1.290 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | 55.0 TO 150.0 DEG CELSIUS |
