NSN 5961-01-133-4566 of Semiconductor Devic - Product Details
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| Alternative NSN: 5961-01-133-4566 |
| Item Name:Semiconductor Devic |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 011334566 |
| NCB Code: USA (01) |
| Manufacturers: Rockwell Collins Aerospace , Microsemi Corp Massachusetts , Cobham Advanced Electronic Solutions , Hewlett Packard Company , Avago Technologies Us Inc , Micro Uspd Inc |
Manufacturer's List for NSN 5961-01-133-4566, 5961011334566
| rockwell collins aerospace | microsemi corp massachusetts | cobham advanced electronic solutions |
| hewlett packard company | avago technologies us inc | micro uspd inc |
Part Number Related To NSN 5961-01-133-4566, 5961011334566
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 922-6508-012 | 5961-01-133-4566 | semiconductor devic | Avl | RFQ |
| GC40605 | 5961-01-133-4566 | semiconductor devic | Avl | RFQ |
| MA47230 | 5961-01-133-4566 | semiconductor devic | Avl | RFQ |
| QPND-4912 | 5961-01-133-4566 | semiconductor devic | Avl | RFQ |
| QPND-4912 | 5961-01-133-4566 | semiconductor devic | Avl | RFQ |
| U9510 | 5961-01-133-4566 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961011334566
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.170 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.076 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | DATA LINK;AIRCRAFT,C-2A REPROCURED ; HELICOPTER,H-53E; EMORY S. LAND CLASS AS; HELICOPTER,ADVANCE ATTACK,AH-1W; 2M/ATE MICROMINIAUTURE AUTOMATIC TEST EQUIPMENT; TARAWA CLASS LHA; LANDING CRAFT AIR CUSHION LCAC ; HELICOPTER,SEARCH AND |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM REVERSE VOLTAGE,PEAK |
| CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| FEAT | SPECIAL FEATURES | HARDNESS CRITICAL PROCESS |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN |
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