NSN 5962-01-393-1609 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-393-1609 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013931609 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Altera Corporation , Northrop Grumman Systems Corporation |
Manufacturer's List for NSN 5962-01-393-1609, 5962013931609
Part Number Related To NSN 5962-01-393-1609, 5962013931609
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ROM/PROM | 5962-01-393-1609 | microcircuit memory | Avl | RFQ |
| NH160478 | 5962-01-393-1609 | microcircuit memory | Avl | RFQ |
| EP900-JM-883B | 5962-01-393-1609 | microcircuit memory | Avl | RFQ |
| 160478 | 5962-01-393-1609 | microcircuit memory | Avl | RFQ |
| 142466-0001 | 5962-01-393-1609 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013931609
| MRC | Criteria | Characteristic |
|---|---|---|
| CZER | Memory Device Type | PAL |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
| CQSJ | Inclosure Material | CERAMIC |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
| TTQY | Terminal Type And Quantity | 44 J-HOOK |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| MRC | Decoded Requirement | Clear Text Reply |
| NHCF | Nuclear Hardness Critical Feature | HARDENED |
| CZEQ | Time Rating Per Chacteristic | 60.00 NANOSECONDS MAXIMUM DELAY |
