NSN 5962-01-317-3180 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-317-3180 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013173180 |
| NCB Code: USA (01) |
| Manufacturers: Integrated Device Technology Inc |
Manufacturer's List for NSN 5962-01-317-3180, 5962013173180
Part Number Related To NSN 5962-01-317-3180, 5962013173180
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| IDT7130LA100CB | 5962-01-317-3180 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013173180
| MRC | Criteria | Characteristic |
|---|---|---|
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAQ | BODY LENGTH | 2.370 INCHES MINIMUM AND 2.430 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.550 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0 TO 150.0 DEG CELSIUS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 44 INPUT |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| TTQY | TERMINAL TYPE AND QUANTITY | 48 PRINTED CIRCUIT |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CBBL | FEATURES PROVIDED | LOW POWER AND HERMETICALLY SEALED AND BURN IN AND HIGH SPEED AND W/ENABLE AND BIDIRECTIONAL |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
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