NSN 5962-01-312-0598 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-312-0598 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013120598 |
| NCB Code: USA (01) |
| Manufacturers: Saab Ab (Publ) Business Area , Saab Ab Publ Business Area Surveillance Ew Systems Jarfalla , Xicor Inc , Dla Land And Maritime , Eaton Aerospace Llc , Seeq Technology Inc , Howden Fluid Systems |
Manufacturer's List for NSN 5962-01-312-0598, 5962013120598
| saab ab (publ) business area | saab ab publ business area surveillance ew systems jarfalla | xicor inc |
| dla land and maritime | eaton aerospace llc | seeq technology inc |
| howden fluid systems |
Part Number Related To NSN 5962-01-312-0598, 5962013120598
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ZD2864 11 2 8 | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| ZD2864 11 2 8 | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| X28C64DMB-25 | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| X2864BDMB-180 | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| ROM/PROM | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| KUD1918G | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| DM28C64-300 B | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| DM28C64 250 B | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| 5962-8751403XX | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| 5962-8751403XB | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| 5962-8751403XA | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| 5962-87514 | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
| 334064P01 | 5962-01-312-0598 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013120598
| MRC | Criteria | Characteristic |
|---|---|---|
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CZEQ | TIME RATING PER CHACTERISTIC | 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| ABKW | OVERALL HEIGHT | 0.357 INCHES MINIMUM AND 0.432 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.25 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 24 INPUT |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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