NSN 5962-01-072-8654 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-072-8654 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010728654 |
| NCB Code: USA (01) |
| Manufacturers: Texas Instruments Inc , Mmi Amd , National Semiconductor Corporation , Mogul Corp The , Advanced Micro Devices Inc , Philips Semiconductors Inc , Lockheed Martin Sippican Inc , Raytheon Company |
Manufacturer's List for NSN 5962-01-072-8654, 5962010728654
| texas instruments inc | mmi amd | national semiconductor corporation |
| mogul corp the | advanced micro devices inc | philips semiconductors inc |
| lockheed martin sippican inc | raytheon company |
Part Number Related To NSN 5962-01-072-8654, 5962010728654
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| SN90547 | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| SN54S189W | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| SM943 | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| RD34347 | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| DH75244 | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| DH75244 | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| CC2017 | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| AM27S03AFM | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
| 932736-1B | 5962-01-072-8654 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962010728654
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND SCHOTTKY AND W/DECODED OUTPUT AND 3-STATE OUTPUT AND W/ENABLE AND W/DISABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | CZF-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 82577-932736 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
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