NSN 5961-01-364-1227 of Semiconductor Devic - Product Details
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| Alternative NSN: 5961-01-364-1227 |
| Item Name:Semiconductor Devic |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 013641227 |
| NCB Code: USA (01) |
| Manufacturers: Micro Uspd Inc , Avago Technologies Us Inc , Quartermaster General |
Manufacturer's List for NSN 5961-01-364-1227, 5961013641227
Part Number Related To NSN 5961-01-364-1227, 5961013641227
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| UM9719 | 5961-01-364-1227 | semiconductor devic | Avl | RFQ |
| QPND-4647 | 5961-01-364-1227 | semiconductor devic | Avl | RFQ |
| 755002A7702-1 | 5961-01-364-1227 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961013641227
| MRC | Criteria | Characteristic |
|---|---|---|
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.4 MAXIMUM |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 100.0 MAXIMUM NONREPETITIVE PEAK REVERSE VOLTAGE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 MICROAMPERES MAXIMUM REVERSE CURRENT,DC |
| ADAV | OVERALL DIAMETER | 0.076 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| MATT | MATERIAL | GLASS INCLOSURE |
| TEST | TEST DATA DOCUMENT | 87990-755002A7702 DRAWING THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING |
| ABHP | OVERALL LENGTH | 0.170 INCHES MAXIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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