NSN 5961-01-130-3987 of Semiconductor Devic - Product Details
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| Alternative NSN: 5961-01-130-3987 |
| Item Name:Semiconductor Devic |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 011303987 |
| NCB Code: USA (01) |
| Manufacturers: Fairchild Semiconductor Corp , General Electric Company , Rockwell Collins Aerospace , Texas Instruments Inc |
Manufacturer's List for NSN 5961-01-130-3987, 5961011303987
| fairchild semiconductor corp | general electric company | rockwell collins aerospace |
| texas instruments inc |
Part Number Related To NSN 5961-01-130-3987, 5961011303987
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 1N4454 | 5961-01-130-3987 | semiconductor devic | Avl | RFQ |
| 1N4454GE | 5961-01-130-3987 | semiconductor devic | Avl | RFQ |
| 353-3644-013 | 5961-01-130-3987 | semiconductor devic | Avl | RFQ |
| 4454 | 5961-01-130-3987 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961011303987
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.155 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.075 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | MULTI-HULL |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-35 |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTRD | POWER RATING PER CHARACTERISTIC | 500.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN |
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