NSN 5961-00-754-9559 of Semiconductor Devic - Product Details
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Alternative NSN: 5961-00-754-9559 |
Item Name:Semiconductor Devic |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 007549559 |
NCB Code: USA (00) |
Manufacturers: Lockheed Martin Corp , General Electric Company , Philips Ecg Inc , General Dynamics Mission Systems |
Manufacturer's List for NSN 5961-00-754-9559, 5961007549559
Part Number Related To NSN 5961-00-754-9559, 5961007549559
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
7439040P1 | 5961-00-754-9559 | semiconductor devic | Avl | RFQ |
7439040P1 | 5961-00-754-9559 | semiconductor devic | Avl | RFQ |
1N630 | 5961-00-754-9559 | semiconductor devic | Avl | RFQ |
13-209520-630 | 5961-00-754-9559 | semiconductor devic | Avl | RFQ |
13 209520 630 | 5961-00-754-9559 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961007549559
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.765 INCHES NOMINAL |
FEAT | SPECIAL FEATURES | BANDL-X; 6.75G HZ; FREQ RANGE 1.0G TO 12.4G MAX HZ |
MATT | MATERIAL | SILICON SEMICONDUCTOR |
ADAV | OVERALL DIAMETER | 0.221 INCHES NOMINAL |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
MATT | MATERIAL | GLASS INCLOSURE |
TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN |