X2804AP by Xicor Inc - Receive a Competitive Quote
| Part Number: X2804AP | Manufacturer: Xicor Inc | NSN : 5962-01-243-1009 | Item Name : Microcircuit Memory | CAGE Code: 60395 | FSC : 5962 Microcircuits Electronic | ||
We’re excited to announce that X2804AP NSN part is now available and ready for immediate shipping. Part number X2804AP is a Microcircuit Memory manufactured by Xicor Inc with NSN 5962012431009. Are you interested in a quick and competitive quote for this part?
Just NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of NSN (National Stock Number) parts, new and obsolete. Because of our dedication to quality, we’re the only independent distributor in the United States with a strict No China Sourcing Pledge. We’re also an AS9120B, ISO 9001:2015 certified, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). Our vast and comprehensive inventory of over 2 billion parts coupled with our shipping facilities in Washington, Oregon, California, New Maxico, Nevada, Arizona, Illinois, Minnesota, Pennsylvania, and New York, allow us to offer you some of the fastest delivery times in the industry.
If you’d like to learn more about NSN part number X2804AP Microcircuit Memory, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@justnsnparts.com. And, if you’d like to stay informed on new inventory or any promotions, feel free to download the ASAP Semiconductor App from Google Play or the App Store.
NSN Information for Part Number X2804AP with NSN 5962-01-243-1009, 5962012431009
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-243-1009 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012431009 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| DQ2804A-300 | 5 | 9 | 5 |
Characteristics Data of NSN 5962-01-243-1009, 5962012431009
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.235 INCHES MINIMUM AND 1.285 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.175 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 0.0 TO 70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND W/ENABLE AND PROGRAMMABLE AND ERASABLE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 20 INPUT |
| CRHL | BIT QUANTITY | 4096 |
| CSWJ | WORD QUANTITY | 512 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 1.0 VOLTS MINIMUM POWER SOURCE AND 24.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
