You have reached the Request for Quote (RFQ) page for part number SKKT323-12E, an item sourced from Semikron Intl Inc (CAGE Code 58687) that is classified with the item name Semiconductor Devic. Here, you can utilize our online form to quickly secure tailored pricing and procurement options from our staff as the first step of procurement. With responses always being quick, be sure to get started as soon as possible if you would like to learn more about this part number.
Important Details for Part Number SKKT323-12E
The part number SKKT323-12E is associated with Semikron Intl Inc, identified by the CAGE Code 58687, and is typically referenced under the item name Semiconductor Devic. It is categorized under the NSN 5961-01-641-4121, with the NIIN 016414121, INC 61962, and NCB code 01 (USA). Additionally, this part falls under the Federal Supply Group (FSG) 59 and Federal Supply Class (FSC) 5961 Semiconductor Devices and Associated Hardware. For more information, these classifications provide further context about the component.
With the form provided, be sure to present our staff with key details on your needs, such as your target pricing, required quantity, and expected turnaround time. Once we receive and review your request for part SKKT323-12E, a member of our staff will contact you in 15 minutes or less to present customized solutions for your comparisons. Once you make a purchase with us, you can expect our staff to work closely with you through each step of fulfillment to ensure that all needs are met with care and efficiency.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-641-4121 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 016414121 | N | A | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| A | A | 0 | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| SKKT323/12E | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | THYRISTOR MODULE |
| ABBH | INCLOSURE MATERIAL | CERAMIC |
| AXGY | MOUNTING METHOD | TERMINAL |
| FEAT | SPECIAL FEATURES | ELECTRICALLY INSULATED BASE PLATE; HEAT TRANSFER THROUGH ALUMINUM OXIDE CERAMIC INSULATED METAL BASE PLATE; CHIP SOLDERED ON DIRECT COPPER BONDED AI2O3 CERAMIC; THYRISTOR WITH CENTER GATE |
| TTQY | TERMINAL TYPE AND QUANTITY | 7 PIN |
| ABHP | OVERALL LENGTH | 115.0 MILLIMETERS NOMINAL |
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ESD S20.20-2014 Certification |
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