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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-389-8835 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013898835 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 6264C-45/BXAJC | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CTQX | Current Rating Per Characteristic | 125.00 MILLIAMPERES MAXIMUM SUPPLY |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 25 INPUT |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND BIDIRECTIONAL AND HIGH IMPEDANCE |
| CQSJ | Inclosure Material | CERAMIC |
| ADAT | Body Width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAQ | Body Length | 1.490 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| ADAU | Body Height | 0.232 INCHES MAXIMUM |
| MRC | Decoded Requirement | Clear Text Reply |
| CTFT | Case Outline Source And Designator | D-10 MIL-M-38510 |
| TTQY | Terminal Type And Quantity | 28 PRINTED CIRCUIT |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| CZEQ | Time Rating Per Chacteristic | 45.00 NANOSECONDS MAXIMUM ACCESS |
| CWSG | Terminal Surface Treatment | SOLDER |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | RAM |
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