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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-444-8076 Item PartTypeName: SEMICONDUCTOR DEVICE,PHOTO | 5961 | 014448076 | N | A | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| A | A | 0 | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 0P830WSL | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| ABHP | OVERALL LENGTH | 0.187 INCHES MINIMUM AND 0.202 INCHES MAXIMUM |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| AXGY | MOUNTING METHOD | UNTHREADED HOLE |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-18 |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS AMBIENT AIR |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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