100-DL211 is a Microcircuit Memory manufactured by Northrop Grumman Defense Mission.

What are the specifications of 100-DL211?

Please contact us for detailed specifications of 100-DL211.

Is 100-DL211 available for immediate shipping?

Yes, we ship worldwide with same-day handling on many parts depending on stock availability.

Can Aerospace Orbit supply bulk quantities of 100-DL211?

Yes, we support both small and large volume orders depending on stock.

Obtain a Quote for Northrop Grumman Defense Mission Part Number 100-DL211 Now

Name: Part Number 100-DL211 - Microcircuit Memory
Brand: Northrop Grumman Defense Mission
SKU: 100-dl211
Availability: InStock
Rating: 4.6 (226 reviews)

Part Number: 100-DL211

Alternate P/N: 100DL211

Manufacturer: Northrop Grumman Defense Mission

NSN: 5962-01-305-5364

NIIN: 01-305-5364

Item Name : microcircuit memory

CAGE Code: 56053

FSC: 5962 Microcircuits Electronic

FSG: 59 Electrical and Electronic Equipment Components

INC Code : 41015

Country: USA

NCB Code: 01

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NSN Information for Part Number 100-DL211 with NSN 5962-01-305-5364, 5962013055364

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-305-5364 Item PartTypeName: MICROCIRCUIT,MEMORY	5962	013055364	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
100-DL211	2	1	5

Characteristics Data of NSN 5962-01-305-5364, 5962013055364

MRC	Criteria	Characteristic
ADAT	BODY WIDTH	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
AFJQ	STORAGE TEMP RANGE	65.0/150.0 DEG CELSIUS
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	6.5 VOLTS MAXIMUM POWER SOURCE
CZZZ	MEMORY CAPACITY	UNKNOWN
ADAQ	BODY LENGTH	1.490 INCHES MAXIMUM
AEHX	MAXIMUM POWER DISSIPATION RATING	1.0 WATTS
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE AND W/ENABLE
CQSJ	INCLOSURE MATERIAL	CERAMIC
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE
CQZP	INPUT CIRCUIT PATTERN	17 INPUT
CZER	MEMORY DEVICE TYPE	ROM
TEST	TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC
TTQY	TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
ADAU	BODY HEIGHT	0.172 INCHES MINIMUM AND 0.217 INCHES MAXIMUM
AFGA	OPERATING TEMP RANGE	55.0/125.0 DEG CELSIUS
CQWX	OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
CTFT	CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510
CWSG	TERMINAL SURFACE TREATMENT	SOLDER
CZEQ	TIME RATING PER CHACTERISTIC	250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 250.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT