You have reached the Request for Quote (RFQ) page for part number PAL16R8A 2ML 883B, an item sourced from Mmi Amd (CAGE Code 50364) that is classified with the item name Microcircuit Memory. Here, you can utilize our online form to quickly secure tailored pricing and procurement options from our staff as the first step of procurement. With responses always being quick, be sure to get started as soon as possible if you would like to learn more about this part number.
Important Details for Part Number PAL16R8A 2ML 883B
The part number PAL16R8A 2ML 883B is associated with Mmi Amd, identified by the CAGE Code 50364, and is typically referenced under the item name Microcircuit Memory. It is categorized under the NSN 5962-01-264-3013, with the NIIN 012643013, INC 41015, and NCB code 01 (USA). Additionally, this part falls under the Federal Supply Group (FSG) 59 and Federal Supply Class (FSC) 5962 Microcircuits Electronic. For more information, these classifications provide further context about the component.
With the form provided, be sure to present our staff with key details on your needs, such as your target pricing, required quantity, and expected turnaround time. Once we receive and review your request for part PAL16R8A 2ML 883B, a member of our staff will contact you in 15 minutes or less to present customized solutions for your comparisons. Once you make a purchase with us, you can expect our staff to work closely with you through each step of fulfillment to ensure that all needs are met with care and efficiency.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-264-3013 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012643013 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| AMPAL16R8L/B2A | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.358 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.358 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES FORWARD CURRENT,MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
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