RA-3-4256 by General Semiconductor Industries Inc - Receive a Competitive Quote
| Part Number: RA-3-4256 | Alternate P/N: RA34256 | Manufacturer: General Semiconductor Industries Inc | NSN : 5962-01-110-7712 | Item Name : Microcircuit Memory | CAGE Code: 14936 | FSC : 5962 Microcircuits Electronic | ||
We’re excited to announce that RA-3-4256 NSN part is now available and ready for immediate shipping. Part number RA-3-4256 is a Microcircuit Memory manufactured by General Semiconductor Industries Inc with NSN 5962011107712. Are you interested in a quick and competitive quote for this part?
Just NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of NSN (National Stock Number) parts, new and obsolete. Because of our dedication to quality, we’re the only independent distributor in the United States with a strict No China Sourcing Pledge. We’re also an AS9120B, ISO 9001:2015 certified, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). Our vast and comprehensive inventory of over 2 billion parts coupled with our shipping facilities in Washington, Oregon, California, New Maxico, Nevada, Arizona, Illinois, Minnesota, Pennsylvania, and New York, allow us to offer you some of the fastest delivery times in the industry.
If you’d like to learn more about NSN part number RA-3-4256 Microcircuit Memory, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@justnsnparts.com. And, if you’d like to stay informed on new inventory or any promotions, feel free to download the ASAP Semiconductor App from Google Play or the App Store.
NSN Information for Part Number RA-3-4256 with NSN 5962-01-110-7712, 5962011107712
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-110-7712 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011107712 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| RA-3-4256 | 2 | 9 | 5 |
Characteristics Data of NSN 5962-01-110-7712, 5962011107712
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.245 INCHES MINIMUM AND 1.255 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.535 INCHES MINIMUM AND 0.545 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.150 INCHES NOMINAL |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 0.0 TO 70.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER AND 3-STATE OUTPUT AND HIGH SPEED |
| CQSJ | INCLOSURE MATERIAL | PLASTIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 15 INPUT |
| CRHL | BIT QUANTITY | 1024 |
| CSWJ | WORD QUANTITY | 256 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 8.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 500.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
