You have reached the Request for Quote (RFQ) page for part number 48586, an item sourced from Gdi Simulation (CAGE Code F2181) that is classified with the item name Semiconductor Device Photo. Here, you can utilize our online form to quickly secure tailored pricing and procurement options from our staff as the first step of procurement. With responses always being quick, be sure to get started as soon as possible if you would like to learn more about this part number.
Important Details for Part Number 48586
The part number 48586 is associated with Gdi Simulation, identified by the CAGE Code F2181, and is typically referenced under the item name Semiconductor Device Photo. It is categorized under the NSN 5961-01-372-4303, with the NIIN 013724303, INC 20587, and NCB code 01 (USA). Additionally, this part falls under the Federal Supply Group (FSG) 59 and Federal Supply Class (FSC) 5961 Semiconductor Devices and Associated Hardware. For more information, these classifications provide further context about the component.
With the form provided, be sure to present our staff with key details on your needs, such as your target pricing, required quantity, and expected turnaround time. Once we receive and review your request for part 48586, a member of our staff will contact you in 15 minutes or less to present customized solutions for your comparisons. Once you make a purchase with us, you can expect our staff to work closely with you through each step of fulfillment to ensure that all needs are met with care and efficiency.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-372-4303 Item PartTypeName: SEMICONDUCTOR DEVICE,PHOTO | 5961 | 013724303 | N | A | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
A | U | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
48586 | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
AFZC | FUNCTION FOR WHICH DESIGNED | PHOTODIODE AND AVALANCHE DIODE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
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