75B049008-1003 by Boeing Company The - Receive a Competitive Quote
Part Number: 75B049008-1003 | Alternate P/N: 75B0490081003 | Manufacturer: Boeing Company The | NSN : 5962-01-365-2256 | Item Name : Microcircuit Memory | CAGE Code: 76301 | FSC : 5962 Microcircuits Electronic | ||
We’re excited to announce that 75B049008-1003 NSN part is now available and ready for immediate shipping. Part number 75B049008-1003 is a Microcircuit Memory manufactured by Boeing Company The with NSN 5962013652256. Are you interested in a quick and competitive quote for this part?
Just NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of NSN (National Stock Number) parts, new and obsolete. Because of our dedication to quality, we’re the only independent distributor in the United States with a strict No China Sourcing Pledge. We’re also an AS9120B, ISO 9001:2015 certified, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). Our vast and comprehensive inventory of over 2 billion parts coupled with our shipping facilities in Washington, Oregon, California, New Maxico, Nevada, Arizona, Illinois, Minnesota, Pennsylvania, and New York, allow us to offer you some of the fastest delivery times in the industry.
If you’d like to learn more about NSN part number 75B049008-1003 Microcircuit Memory, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@justnsnparts.com. And, if you’d like to stay informed on new inventory or any promotions, feel free to download the ASAP Semiconductor App from Google Play or the App Store.
NSN Information for Part Number 75B049008-1003 with NSN 5962-01-365-2256, 5962013652256
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-365-2256 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013652256 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
ROM/PROM FAMILY 186 | 5 | 1 | 5 |
Characteristics Data of NSN 5962-01-365-2256, 5962013652256
MRC | Criteria | Characteristic |
---|---|---|
AEHX | MAXIMUM POWER DISSIPATION RATING | 633.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | PROGRAMMED |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM APPLIED AND 7.0 VOLTS MAXIMUM APPLIED |
AFJQ | STORAGE TEMP RANGE | 65.0 TO 150.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS NOMINAL ACCESS |
TEST | TEST DATA DOCUMENT | 76301-75B049008-1003 DRAWING THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNI |
ZZZK | SPECIFICATION/STANDARD DATA | 96906-MIL-STD-883 GOVERNMENT STANDARD |
AGAV | END ITEM IDENTIFICATION | LUG IN UNIT E/I FSCM 76301 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZER | MEMORY DEVICE TYPE | PROM |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,DIGITAL-PROGRAMMABLE READ ONLY MEMORY PROM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |