You have reached the Request for Quote (RFQ) page for part number MMI6301-J, an item sourced from Advanced Micro Devices Inc (CAGE Code 34335) that is classified with the item name Microcircuit Memory. Here, you can utilize our online form to quickly secure tailored pricing and procurement options from our staff as the first step of procurement. With responses always being quick, be sure to get started as soon as possible if you would like to learn more about this part number.
Important Details for Part Number MMI6301-J
The part number MMI6301-J is associated with Advanced Micro Devices Inc, identified by the CAGE Code 34335, and is typically referenced under the item name Microcircuit Memory. It is categorized under the NSN 5962-01-373-9120, with the NIIN 013739120, INC 41015, and NCB code 01 (USA). Additionally, this part falls under the Federal Supply Group (FSG) 59 and Federal Supply Class (FSC) 5962 Microcircuits Electronic. For more information, these classifications provide further context about the component.
With the form provided, be sure to present our staff with key details on your needs, such as your target pricing, required quantity, and expected turnaround time. Once we receive and review your request for part MMI6301-J, a member of our staff will contact you in 15 minutes or less to present customized solutions for your comparisons. Once you make a purchase with us, you can expect our staff to work closely with you through each step of fulfillment to ensure that all needs are met with care and efficiency.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-373-9120 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013739120 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
PR979738-114 | 5 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ZZZP | III PURCHASE DESCRIPTION IDENTIFICATION | 49956-979738-114 |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
AGAV | III END ITEM IDENTIFICATION | DISPLAY CONSO E/I FSCM 49956 |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CRHL | (NON-CORE DATA) BIT QUANTITY | 1024 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM OUTPUT |
CZER | MEMORY DEVICE TYPE | EEPROM |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | 1024-BIT BIPOLAR(256X4) ELECTRICALLY PROGRAMMABLE READ ONLY MEMORY |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM APPLIED AND 7.0 VOLTS MAXIMUM APPLIED |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CBBL | FEATURES PROVIDED | BIPOLAR AND ELECTRICALLY ALTERABLE AND LOW POWER AND PROGRAMMED AND HIGH RELIABILITY |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
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FAA AC 0056B Accredited |
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AS 6081:2012 Certification |
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ESD S20.20-2014 Certification |
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