NSN 5962-01-336-5571 of Microcircuit Memory - Product Details
Just NSN Parts, owned and operated by ASAP Semiconductor, is an industry-leading distributor of NSN 5962-01-336-5571 parts applicable in the aviation and defense industries. We aim to simplify the NSN 5962-01-336-5571 parts procurement process by enabling our customers to search through our inventory quickly and efficiently. Type in your desired NSN 5962-01-336-5571 part number such as 5962-85155, 5962-8515504SA, 5962-8515504SB, 5962-8515504SX, PAL16R4BMW 883B into our search engine and, in a matter of seconds, available stock will appear.
We pride ourselves on our attention to detail and focus on quality control. We are FAA AC 0056B accredited and AS9120B, ISO 9001:2015 certified. We offer our customers a personalized and reliable service that will change your parts procurement process. If you would like to receive a quote today, fill out a request for quote form today.
Alternative NSN: 5962-01-336-5571 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013365571 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Mmi Amd , Texas Instruments Inc |
Manufacturer's List for NSN 5962-01-336-5571, 5962013365571
Part Number Related To NSN 5962-01-336-5571, 5962013365571
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
5962-85155 | 5962-01-336-5571 | microcircuit memory | Avl | RFQ |
5962-8515504SA | 5962-01-336-5571 | microcircuit memory | Avl | RFQ |
5962-8515504SB | 5962-01-336-5571 | microcircuit memory | Avl | RFQ |
5962-8515504SX | 5962-01-336-5571 | microcircuit memory | Avl | RFQ |
PAL16R4BMW 883B | 5962-01-336-5571 | microcircuit memory | Avl | RFQ |
ROM/PROM | 5962-01-336-5571 | microcircuit memory | Avl | RFQ |
TIBPAL16R4-20MWB | 5962-01-336-5571 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013365571
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
CZER | MEMORY DEVICE TYPE | PAL |
TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.1 WATTS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND PROGRAMMABLE AND BIPOLAR |