NSN 5962-01-319-5842 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-319-5842 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013195842 |
| NCB Code: USA (01) |
| Manufacturers: Bacharach Inc , Dla Land And Maritime , Atmel Corporation , Waferscale Integration Inc |
Manufacturer's List for NSN 5962-01-319-5842, 5962013195842
Part Number Related To NSN 5962-01-319-5842, 5962013195842
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 404-2308 | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| 5962-86063 | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| 5962-8606305BXA | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| 5962-8606305BXB | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| 5962-8606305BXX | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| 5962-8606305XA | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| 5962-8606305XB | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| 5962-8606305XX | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| AT27C256 15 DM 883 | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| ROM/PROM | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
| WS27C256-15DMB | 5962-01-319-5842 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013195842
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | 65.0 TO 150.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
| ADAQ | BODY LENGTH | 1.490 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.217 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 55.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-10 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZER | MEMORY DEVICE TYPE | ROM |
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