NSN 5962-01-182-0553 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-182-0553 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 011820553 |
| NCB Code: USA (01) |
| Manufacturers: Dla Land And Maritime , Military Specifications , Northrop Grumman Corp , Dpa Labs Inc |
Manufacturer's List for NSN 5962-01-182-0553, 5962011820553
Part Number Related To NSN 5962-01-182-0553, 5962011820553
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| ROM/PROM FAMILY 008 | 5962-01-182-0553 | microcircuit memory | Avl | RFQ |
| M38510/20402BEA | 5962-01-182-0553 | microcircuit memory | Avl | RFQ |
| 33656-2901 | 5962-01-182-0553 | microcircuit memory | Avl | RFQ |
| 336546-2901 | 5962-01-182-0553 | microcircuit memory | Avl | RFQ |
| 336546-2901 | 5962-01-182-0553 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962011820553
| MRC | Criteria | Characteristic |
|---|---|---|
| AEHX | MAXIMUM POWER DISSIPATION RATING | 794.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 85.00 NANOSECONDS MAXIMUM DELAY |
| CZER | MEMORY DEVICE TYPE | PROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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