NSN 5962-01-033-0745 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-033-0745 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 010330745 |
| NCB Code: USA (01) |
| Manufacturers: Philips Semiconductors Inc , Dla Land And Maritime , Mmi Amd , Intersil Corporation , Alliant Techsystems Operations Llc |
Manufacturer's List for NSN 5962-01-033-0745, 5962010330745
| philips semiconductors inc | dla land and maritime | mmi amd |
| intersil corporation | alliant techsystems operations llc |
Part Number Related To NSN 5962-01-033-0745, 5962010330745
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| S8223F 883C | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| ROM PROM FAMILY 003 | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| MM5330J 883C | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| HPROM1-8256-883C | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| 5330J 883C | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| 10842-9 | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| 10842-9 | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| 10842-9 | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
| 10842-9 | 5962-01-033-0745 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962010330745
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.896 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | BLDG BLOCK 57 FSCM 30003 |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND BIPOLAR AND W/BUFFERED OUTPUT AND W/DECODED OUTPUT AND EXPANDABLE AND HIGH SPEED AND WIRE-OR OUTPUTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| TEST | TEST DATA DOCUMENT | 06424-10842 DRAWING THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWIN |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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