NSN 5961-01-135-0719 of Semiconductor Devic - Product Details
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| Alternative NSN: 5961-01-135-0719 |
| Item Name:Semiconductor Devic |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 011350719 |
| NCB Code: USA (01) |
| Manufacturers: Micro Uspd Inc , Northrop Grumman Systems Corporation , Freescale Semiconductor Inc , Philips Ecg Inc |
Manufacturer's List for NSN 5961-01-135-0719, 5961011350719
Part Number Related To NSN 5961-01-135-0719, 5961011350719
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| S20450 | 5961-01-135-0719 | semiconductor devic | Avl | RFQ |
| R3100515-06 | 5961-01-135-0719 | semiconductor devic | Avl | RFQ |
| MR1125 | 5961-01-135-0719 | semiconductor devic | Avl | RFQ |
| 5883 | 5961-01-135-0719 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961011350719
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.405 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 1 |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-4 |
| ALBA | ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | CATHODE |
| AXGY | MOUNTING METHOD | THREADED STUD |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CCDG | OVERALL WIDTH ACROSS FLATS | 0.437 INCHES MAXIMUM |
| CQJX | NOMINAL THREAD SIZE | 0.190 INCHES |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 500.0 MAXIMUM REVERSE VOLTAGE,PEAK AND 350.0 MAXIMUM REVERSE VOLTAGE,TOTAL RMS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| CTRD | POWER RATING PER CHARACTERISTIC | 3.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 190.0 DEG CELSIUS JUNCTION |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| THSD | THREAD SERIES DESIGNATOR | UNF |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 TAB,SOLDER LUG AND 1 THREADED STUD |
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