NSN 5961-00-043-1383 of Semiconductor Devic - Product Details
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Alternative NSN: 5961-00-043-1383 |
Item Name:Semiconductor Devic |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 000431383 |
NCB Code: USA (00) |
Manufacturers: Freescale Semiconductor Inc , Micro Uspd Inc , Gilbert Engineering Co Inc Incon , Hi G Co Inc |
Manufacturer's List for NSN 5961-00-043-1383, 5961000431383
Part Number Related To NSN 5961-00-043-1383, 5961000431383
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
SCR5063 | 5961-00-043-1383 | semiconductor devic | Avl | RFQ |
ID101 | 5961-00-043-1383 | semiconductor devic | Avl | RFQ |
CR34005 | 5961-00-043-1383 | semiconductor devic | Avl | RFQ |
AS304 | 5961-00-043-1383 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961000431383
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL |
ABHP | OVERALL LENGTH | 0.210 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 0.500 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.195 INCHES MAXIMUM |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
ALBA | ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | ANODE |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNPN |
TTQY | TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |