BB809 by Philips Circuit Assemblies - Receive a Competitive Quote
| Part Number: BB809 | Manufacturer: Philips Circuit Assemblies | NSN : 5961-01-172-2337 | Item Name : Semiconductor Devic | CAGE Code: 25403 | FSC : 5961 Semiconductor Devices and Associated Hardware | ||
We’re excited to announce that BB809 NSN part is now available and ready for immediate shipping. Part number BB809 is a Semiconductor Devic manufactured by Philips Circuit Assemblies with NSN 5961011722337. Are you interested in a quick and competitive quote for this part?
Just NSN Parts, owned and operated by ASAP Semiconductor, is a leading distributor of NSN (National Stock Number) parts, new and obsolete. Because of our dedication to quality, we’re the only independent distributor in the United States with a strict No China Sourcing Pledge. We’re also an AS9120B, ISO 9001:2015 certified, and FAA AC 0056B accredited member of the Aviation Suppliers Association (ASA). Our vast and comprehensive inventory of over 2 billion parts coupled with our shipping facilities in Washington, Oregon, California, New Maxico, Nevada, Arizona, Illinois, Minnesota, Pennsylvania, and New York, allow us to offer you some of the fastest delivery times in the industry.
If you’d like to learn more about NSN part number BB809 Semiconductor Devic, feel free to call us at our toll-free number, +1-714-705-4780, or email us at sales@justnsnparts.com. And, if you’d like to stay informed on new inventory or any promotions, feel free to download the ASAP Semiconductor App from Google Play or the App Store.
NSN Information for Part Number BB809 with NSN 5961-01-172-2337, 5961011722337
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-172-2337 Item PartTypeName: SEMICONDUCTOR DEVICE,DIODE | 5961 | 011722337 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| BB809 | C | 1 | C | A |
Characteristics Data of NSN 5961-01-172-2337, 5961011722337
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAV | OVERALL DIAMETER | 0.115 INCHES NOMINAL |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.0 MAXIMUM REVERSE VOLTAGE,DC |
| CTQS | VOLTAGE TOLERANCE IN PERCENT | 10.0 TO 10.0 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT,AVERAGE |
| CTRD | POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
Part BB809 With Different Manufacturers
