NSN 5962-01-350-5824 of Microcircuit Memory - Product Details
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Alternative NSN: 5962-01-350-5824 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NIIN: 013505824 |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Cypress Semiconductor Corporatio , Matra Harris Semiconductor , Integrated Device Technology Inc , Freescale Semiconductor Inc , Micron Industries Corp , Performance Semiconductor Corp |
Manufacturer's List for NSN 5962-01-350-5824, 5962013505824
dla land and maritime | cypress semiconductor corporatio | matra harris semiconductor |
integrated device technology inc | freescale semiconductor inc | micron industries corp |
performance semiconductor corp |
Part Number Related To NSN 5962-01-350-5824, 5962013505824
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
5368-8552560ZX | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
5962-38294 | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
5962-3829411MZA | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
5962-3829411MZB | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
5962-3829411MZX | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
CY7C185A-45DMB | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
HM1-65764M 883 | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
IDT7164S45DB | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
IDT7164S45DMB | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
MCM6164C45 | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
MT5C6408C-45 | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
P4C164-45DMB | 5962-01-350-5824 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013505824
MRC | Criteria | Characteristic |
---|---|---|
ADAU | BODY HEIGHT | 0.215 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
ADAQ | BODY LENGTH | 1.485 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 25 INPUT |
CTQX | CURRENT RATING PER CHARACTERISTIC | 125.00 MILLIAMPERES MAXIMUM SUPPLY |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
ABKW | OVERALL HEIGHT | 0.430 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | 65.0 TO 150.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | RAM |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | 55.0 TO 125.0 DEG CELSIUS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-15 MIL-M-38510 |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 15.00 INPUT PICOFARADS MAXIMUM AND 20.00 OUTPUT PICOFARADS MAXIMUM |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM ACCESS |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |