NSN 5962-01-339-7104 of Microcircuit Memory - Product Details
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| Alternative NSN: 5962-01-339-7104 |
| Item Name:Microcircuit Memory |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5962 Microcircuits Electronic |
| NIIN: 013397104 |
| NCB Code: USA (01) |
| Manufacturers: Rockwell Collins Aerospace , Dla Land And Maritime , General Dynamics Land Systems , Cypress Semiconductor Corporatio , Mmi Amd |
Manufacturer's List for NSN 5962-01-339-7104, 5962013397104
| rockwell collins aerospace | dla land and maritime | general dynamics land systems |
| cypress semiconductor corporatio | mmi amd |
Part Number Related To NSN 5962-01-339-7104, 5962013397104
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 351-5866-012 | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| 391-0351-032 | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| 5962-88670 | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| 5962-8867002LA | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| 5962-8867002LB | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| 5962-8867002LX | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| 7573733-300 | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| PALC22V10-30DMB | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| PALC22V10H-30MJS883B | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| ROM PROM HEAD 264 | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
| ROM/PROM | 5962-01-339-7104 | microcircuit memory | Avl | RFQ |
Characteristics Data of NSN 5962013397104
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | 65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND PROGRAMMED AND POSITIVE OUTPUTS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | AND-OR LOGIC ARRAY |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC |
| AFGA | OPERATING TEMP RANGE | 55.0/125.0 DEG CELSIUS |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 16.00 MILLIAMPERES FORWARD CURRENT,NONREPETITIVE,MAXIMUM PEAK TOTAL VALUE NOMINAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM ACCESS |
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