NSN 5961-01-357-4776 of Semiconductor Devic - Product Details
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| Alternative NSN: 5961-01-357-4776 |
| Item Name:Semiconductor Devic |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 013574776 |
| NCB Code: USA (01) |
| Manufacturers: Quartermaster General , Fei Microwave Inc , Cobham Advanced Electronic Solutions , Microsemi Corp Massachusetts , Hewlett Packard Company , Avago Technologies Us Inc |
Manufacturer's List for NSN 5961-01-357-4776, 5961013574776
| quartermaster general | fei microwave inc | cobham advanced electronic solutions |
| microsemi corp massachusetts | hewlett packard company | avago technologies us inc |
Part Number Related To NSN 5961-01-357-4776, 5961013574776
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 755002C7005-1 | 5961-01-357-4776 | semiconductor devic | Avl | RFQ |
| A5X1124 | 5961-01-357-4776 | semiconductor devic | Avl | RFQ |
| A5X1124 | 5961-01-357-4776 | semiconductor devic | Avl | RFQ |
| GC41235-15 | 5961-01-357-4776 | semiconductor devic | Avl | RFQ |
| QPND-4141 | 5961-01-357-4776 | semiconductor devic | Avl | RFQ |
| QPND-4141 | 5961-01-357-4776 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961013574776
| MRC | Criteria | Characteristic |
|---|---|---|
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.068 INCHES MINIMUM AND 0.077 INCHES MAXIMUM |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS JUNCTION |
| MATT | MATERIAL | GLASS INCLOSURE |
| ABHP | OVERALL LENGTH | 0.150 INCHES MINIMUM AND 0.170 INCHES MAXIMUM |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 70.0 MAXIMUM REVERSE VOLTAGE,INSTANTANEOUS |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| CBBL | FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED CASE AND ELECTROSTATIC SENSITIVE |
| CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| AXGY | MOUNTING METHOD | TERMINAL |
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