NSN 5961-01-357-1125 of Semiconductor Devic - Product Details
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| Alternative NSN: 5961-01-357-1125 |
| Item Name:Semiconductor Devic |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 013571125 |
| NCB Code: USA (01) |
| Manufacturers: Lockheed Martin Corp , Dla Land And Maritime , Hewlett Packard Company , Avago Technologies Us Inc |
Manufacturer's List for NSN 5961-01-357-1125, 5961013571125
Part Number Related To NSN 5961-01-357-1125, 5961013571125
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 7555305P0601 | 5961-01-357-1125 | semiconductor devic | Avl | RFQ |
| 7555305P601 | 5961-01-357-1125 | semiconductor devic | Avl | RFQ |
| NH7555305P601 | 5961-01-357-1125 | semiconductor devic | Avl | RFQ |
| QSRD-4645 | 5961-01-357-1125 | semiconductor devic | Avl | RFQ |
| QSRD-4645 | 5961-01-357-1125 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961013571125
| MRC | Criteria | Characteristic |
|---|---|---|
| ABMK | OVERALL WIDTH | 0.015 INCHES NOMINAL |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 15.0 MINIMUM BREAKDOWN VOLTAGE,INSTANTANEOUS |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 0.1 MINIMUM AND 0.37 MAXIMUM |
| ABHP | OVERALL LENGTH | 0.015 INCHES NOMINAL |
| AXGY | MOUNTING METHOD | PRESS FIT |
| CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEM |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TTQY | TERMINAL TYPE AND QUANTITY | 1 BONDING PAD |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
Get More Relevant NSN for NSN 5961-01-357-1125, 5961013571125
