NSN 5961-01-337-6449 of Semiconductor Devic - Product Details
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| Alternative NSN: 5961-01-337-6449 |
| Item Name:Semiconductor Devic |
| FSG: 59 Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
| NIIN: 013376449 |
| NCB Code: USA (01) |
| Manufacturers: Behlman Electronics Inc , Philips Circuit Assemblies |
Manufacturer's List for NSN 5961-01-337-6449, 5961013376449
Part Number Related To NSN 5961-01-337-6449, 5961013376449
| Part No | NSN | Item Name | QTY | RFQ |
|---|---|---|---|---|
| 101-9466 | 5961-01-337-6449 | semiconductor devic | Avl | RFQ |
| BYV10-30 | 5961-01-337-6449 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961013376449
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 4.8 MILLIMETERS MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | TACTICAL AIR OPERATIONS MODULE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 DEG CELSIUS JUNCTION |
| ADAV | OVERALL DIAMETER | 2.6 MILLIMETERS MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 1.00 AMPERES NOMINAL FORWARD CURRENT,AVERAGE |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| ABJT | TERMINAL LENGTH | 28.0 MILLIMETERS MINIMUM |
| MATT | MATERIAL | GLASS OR CERAMIC INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
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