NSN 5961-01-172-2337 of Semiconductor Devic - Product Details
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Alternative NSN: 5961-01-172-2337 |
Item Name:Semiconductor Devic |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 011722337 |
NCB Code: USA (01) |
Manufacturers: Hewlett Packard Company , Philips Consumer Lifestyle B V , Philips Circuit Assemblies , Wayne Kerr Electronics Inc , Freescale Semiconductor Inc |
Manufacturer's List for NSN 5961-01-172-2337, 5961011722337
hewlett packard company | philips consumer lifestyle b v | philips circuit assemblies |
wayne kerr electronics inc | freescale semiconductor inc |
Part Number Related To NSN 5961-01-172-2337, 5961011722337
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
0122-0152 | 5961-01-172-2337 | semiconductor devic | Avl | RFQ |
0122-0162 | 5961-01-172-2337 | semiconductor devic | Avl | RFQ |
0122-0326 | 5961-01-172-2337 | semiconductor devic | Avl | RFQ |
BB809 | 5961-01-172-2337 | semiconductor devic | Avl | RFQ |
BB809 | 5961-01-172-2337 | semiconductor devic | Avl | RFQ |
DG809 | 5961-01-172-2337 | semiconductor devic | Avl | RFQ |
SMV1603 | 5961-01-172-2337 | semiconductor devic | Avl | RFQ |
Characteristics Data of NSN 5961011722337
MRC | Criteria | Characteristic |
---|---|---|
ADAV | OVERALL DIAMETER | 0.115 INCHES NOMINAL |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 3.0 MAXIMUM REVERSE VOLTAGE,DC |
CTQS | VOLTAGE TOLERANCE IN PERCENT | 10.0 TO 10.0 |
CTQX | CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT,AVERAGE |
CTRD | POWER RATING PER CHARACTERISTIC | 400.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
MATT | MATERIAL | GLASS INCLOSURE |
MATT | MATERIAL | SILICON SEMICONDUCTOR |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |