NSN 5961-01-013-0829 of Semiconductor Device Photo - Product Details
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Alternative NSN: 5961-01-013-0829 |
Item Name:Semiconductor Device Photo |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NIIN: 010130829 |
NCB Code: USA (01) |
Manufacturers: Lockheed Martin Corporation , L 3 Communications Corporation , Spectronics Corporation , Honeywell Intl Inc , General Electric Company |
Manufacturer's List for NSN 5961-01-013-0829, 5961010130829
lockheed martin corporation | l 3 communications corporation | spectronics corporation |
honeywell intl inc | general electric company |
Part Number Related To NSN 5961-01-013-0829, 5961010130829
Part No | NSN | Item Name | QTY | RFQ |
---|---|---|---|---|
7904538-00 | 5961-01-013-0829 | semiconductor device photo | Avl | RFQ |
7904538-00 | 5961-01-013-0829 | semiconductor device photo | Avl | RFQ |
SCA1374 | 5961-01-013-0829 | semiconductor device photo | Avl | RFQ |
SE5451-3 | 5961-01-013-0829 | semiconductor device photo | Avl | RFQ |
SPC1374 | 5961-01-013-0829 | semiconductor device photo | Avl | RFQ |
SSL55C | 5961-01-013-0829 | semiconductor device photo | Avl | RFQ |
Characteristics Data of NSN 5961010130829
MRC | Criteria | Characteristic |
---|---|---|
ABKW | OVERALL HEIGHT | 0.235 INCHES NOMINAL |
ADAV | OVERALL DIAMETER | 0.219 INCHES NOMINAL |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | GALLIUM ARSENIDE |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |